ABOUT GME

Welcome to GME

Founded in 1987, GME has attained 124 patents on crushers & mills over the past 30 years. More than 30 overseas offices not only manifest our popularity, but also solve your puzzles quickly in operation. So if you are looking for crushers or mills, GME deserves your attention!

GME gives itself over to the production of crushers and mills, which can be used in aggregate crushing, industrial milling and ore processing fields, such as sand making machine, portable crusher plant, vibrating screen and raymond mill, If you are engaged in these industries, why not choose GME?

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Hot Products

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Vertical Grinding Mills

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LUM Ultrafine Mill

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MTM Trapezium Mill

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Ball Mill

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MTW Trapezium Mill

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SCM Ultrafine Mill

Limestone Grinding Plant

The customer belongs to a well-known company in local community. The biggest difficulty in this project was small place. It had to consider both the maintenance space of the equipment and the transportation of finished products.

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Limestone Grinding in Belgium

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Limestone Grinding Plant

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Talc processing plant

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Ultrafine Powder Milling

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Trapezium Grinding plant

Booking Online

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  • Backgrinding - Desert Silicon

    Backgrinding is the process of removal of silicon from the back of wafers following conventional semiconductor processing. The process is primarily utilized in thinning wafers for commercial semiconductor wafer fabs. Wafers are first laminated using an automatic

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  • CiteSeerX — ANALYSIS ON GEOMETRY AND SURFACE OF …

    CiteSeerX - Document Details (Isaac Councill, Lee Giles, Pradeep Teregowda): This paper examines the warpage on the backside of silicon wafer after thinning process. The thinning process includes after backgrinding (BG) and after wet etching (WE). The results on ...

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  • The back-end process: Step 3 – Wafer backgrinding | …

    The Backgrinding Process To improve the productivity of an operation, a multi-step grinding operation is generally performed. The first step uses a large grit to coarsely grind the wafer and remove the bulk of the excess wafer thickness.

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  • CiteSeerX — ANALYSIS ON GEOMETRY AND SURFACE OF …

    CiteSeerX - Document Details (Isaac Councill, Lee Giles, Pradeep Teregowda): This paper examines the warpage on the backside of silicon wafer after thinning process. The thinning process includes after backgrinding (BG) and after wet etching (WE). The results on ...

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  • Fine grinding of silicon wafers

    Besides being a major flattening process, surface grinding has also been proposed to replace etching [5], even for producing 400 mm silicon wafers [6]. In addition to its applications in silicon wafer manufacturing, surface grinding has also been used for

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  • Study of damage and stress induced by backgrinding in Si wafers

    backgrinding in Si wafers To cite this article: Jian Chen and Ingrid De Wolf 2003 Semicond. Sci. Technol. 18 261 View the article online for updates and enhancements. Related content Process induced sub-surface damage in mechanically ground silicon wafers

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  • Silicon Wafer Manufacturers & Suppliers | Wafer World …

    Wafer backgrinding is the process of grating the back part of the wafer to achieve the desired wafer breadth before assembly. It has become an essential part of wafer manufacturing, especially with today's demand for thinner Germanium wafers. Here you can find

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  • silicon wafer backgrinding process - Sattwanu

    silicon wafer backgrinding process etsiviaggiarecisl Wafer backgrinding, also referred to as "backlap" or "wafer thinning," is a process in which the backside of a wafer is ground down, producing a thinner wafer that allows more layers and a higher density of integrated circuits to fit in a smaller package.

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  • Wafer backgrinding - Wikipedia

    The backgrinding process involves using a diamond-resin bonded grinding wheel to remove the silicon material from the back of a silicon wafer. Using a grinding wheel is highly effective, and faster and less expensive than chemical-mechanical processes and is used to remove the bulk of substrate material prior to final finish grind, polish or chemical etch.

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  • Introduction to Semico nductor Manufacturing and FA Process

    6/10/2017· Silicon Wafer Production Process 1. Polycrystalline Silicon 2. Crystal Growth 3. Single Crystal Silicon Ingot 4. Crystal Trimming and Grinding 5. Slicing 6. Edge Rounding 7. Lapping 8. Etching(Chemical Polishing) 9. Polishing 10. Cleaning 11. Inspection

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  • Wafer Processing Adhesives and Solutions - AI …

    By eliminating the traditional glass carrier or silicon wafer carrier, wafer per hour throughput is greatly increased. To successfully enable wafer processing with disposable carrier the key is the innovative, molecularly engineered temporary bonding adhesive: highly conforming, stretchable, and flexible temporary bonding adhesive yet with high shear bonding strength and high temperature ...

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  • Wafer Backgrinding | Wafer Dicing | Wafer Inspection

    We are at the forefront of wafer dicing, backgrinding, and inspection and have the expertise to process semiconductor and silicon wafers to your unique specifications. Our goal is to achieve creative solutions where problems exist and deliver quick cycle times without sacrificing quality.

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  • silicon wafer backgrinding process - Sattwanu

    silicon wafer backgrinding process etsiviaggiarecisl Wafer backgrinding, also referred to as "backlap" or "wafer thinning," is a process in which the backside of a wafer is ground down, producing a thinner wafer that allows more layers and a higher density of integrated circuits to fit in a smaller package.

    Get Price
  • Silicon wafers, silicon wafer processing and related …

    Addison Engineering s a leading supplier of silicon wafers, silicon wafer processing, semiconductor process, test, and assembly equipment, silicon wafer operations management, ceramic packages and related semiconductor materials and services.

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  • Wafer Backgrind - AnySilicon Semipedia

    Wafer backgriding is a process of thinning the wafer to meet the required thickness before packaging the die into its package. Wafer backgrinding is also called wafer thinning or wafer back-lapping. Backgrinding process is not a mandatory step in ASIC production, however, thinner semiconductor packages has made it unavoidable.

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  • Wafer backgrinding - Wikipedia

    Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. that undergo a multitude of processing steps.

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  • Backgrinding Machine Sorece

    The backgrinding process involves using a diamond-resin bonded grinding wheel to remove the silicon material from the back of a silicon wafer. Using a grinding wheel is highly effective, and faster and less expensive than chemical-mechanical processes and is used to remove the bulk of substrate material prior to final finish grind, polish or chemical etch.

    Get Price
  • Wafer Backgrind - AnySilicon Semipedia

    November 20, 2017, anysilicon Wafer backgriding is a process of thinning the wafer to meet the required thickness before packaging the die into its package. Wafer backgrinding is also called wafer thinning or wafer back-lapping.

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  • Wafer thinning and wafer backgrinding service - …

    Anodic bonded wafers Silicon on Pyrex, one side to 10 microns Single sided wafer thinning: Valley Design's wafer thinning method protects the process side of the wafer which often has various structures or devices already there.

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  • wafer tech

    Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to

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  • NOVEL ULTRAFILTRATION OPERATING PROCESS FOR SILICON WAFER …

    AWWA/AMTA© 1 NOVEL ULTRAFILTRATION OPERATING PROCESS FOR SILICON WAFER PRODUCTION WASTEWATER REUSE Ben Freeman Hydranautics – A Nitto Group CompanyAWWA/AMTA© 3 Introduction • 2010 Water Consumption = 450

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  • Silicon Wafer Backgrinding Process

    Wafer Backgrinding Silicon Wafer Thinning Wafer Backgrind Wafer backgrinding, or wafer thinning, is a semiconductor manufacturing process designed to reduce wafer thickness. This essential manufacturing step produces ultra-thin wafers for stacking and high-density packaging in compact electronic devices.

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  • Silicon wafers, silicon wafer processing and related …

    Addison Engineering s a leading supplier of silicon wafers, silicon wafer processing, semiconductor process, test, and assembly equipment, silicon wafer operations management, ceramic packages and related semiconductor materials and services.

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  • Warping of silicon wafers subjected to back-grinding …

    1/4/2015· The grinding-based back-thinning process is featured with a rotating wafer which is held by a vacuum chuck,. The wafer is induced with stresses by grinding which are partially released when the wafer is removed from the chuck. Residual stresses are thus left in the ground wafer.

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  • ICROS™ Tape | Business and Products | MITSUI …

    The ICROS bumped wafer tapes feature a soft adhesive for good bump absorption to prevent water penetration and wafer breakage ICROS Tape is High-clean adhesive tape and is mainly used for Ultra clean, protective tape for silicon wafer back-grinding process in ...

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  • Wafer Processing Adhesives and Solutions - AI …

    Backgrinding to thin out the device wafer and 2.5D-3D wafer processing on the thinned backside have many different processing steps. The temporary bonding adhesive on carrier supporting the processing must also have different adhesive characteristics such as bonding strength, and resistance to water, solvent, vacuum and temperature exposure.

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  • Ultrathin Wafer Pre-Assembly and Assembly Process …

    7/5/2015· Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 μm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly.

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  • Wafer thinning and wafer backgrinding service - …

    Anodic bonded wafers Silicon on Pyrex, one side to 10 microns Single sided wafer thinning: Valley Design's wafer thinning method protects the process side of the wafer which often has various structures or devices already there.

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  • (PDF) Warping of Silicon Wafers Subjected to Back …

    24/10/2014· This study investigates warping of silicon wafers in ultra-precision grinding-based back-thinning process.

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  • Silicon Wafer Manufacturers & Suppliers | Wafer World …

    Wafer backgrinding is the process of grating the back part of the wafer to achieve the desired wafer breadth before assembly. It has become an essential part of wafer manufacturing, especially with today's demand for thinner Germanium wafers. Here you can find

    Get Price
  • Semiconductor wafer backgrinding and shaping - …

    Wafer backgrinding, lapping, polishing Dicing to 6" diameter Optical grade materials from stock Cylindrical grinding Wafer thinning Flattening Complex wafer shaping Surface flat orientation Testing for type and resistivity Downsizing Process development and R ...

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  • Silicon Wafer Backgrinding Process

    Wafer Backgrinding Silicon Wafer Thinning Wafer Backgrind Wafer backgrinding, or wafer thinning, is a semiconductor manufacturing process designed to reduce wafer thickness. This essential manufacturing step produces ultra-thin wafers for stacking and high-density packaging in compact electronic devices.

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  • grinding silicon process - Parrocchia Santa Barbara in Agro

    Fine grinding of silicon wafers: a mathematical model for 59 The majority of today's integrated circuits are constructed on silicon wafers. Fine-grinding process has great potential to improve 60 wafer quality at a low cost. Three papers on fine grinding wereget price

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