ABOUT GME

Welcome to GME

Founded in 1987, GME has attained 124 patents on crushers & mills over the past 30 years. More than 30 overseas offices not only manifest our popularity, but also solve your puzzles quickly in operation. So if you are looking for crushers or mills, GME deserves your attention!

GME gives itself over to the production of crushers and mills, which can be used in aggregate crushing, industrial milling and ore processing fields, such as sand making machine, portable crusher plant, vibrating screen and raymond mill, If you are engaged in these industries, why not choose GME?

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Hot Products

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Vertical Grinding Mills

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LUM Ultrafine Mill

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MTM Trapezium Mill

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Ball Mill

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MTW Trapezium Mill

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SCM Ultrafine Mill

Limestone Grinding Plant

The customer belongs to a well-known company in local community. The biggest difficulty in this project was small place. It had to consider both the maintenance space of the equipment and the transportation of finished products.

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Limestone Grinding in Belgium

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Limestone Grinding Plant

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Talc processing plant

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Ultrafine Powder Milling

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Trapezium Grinding plant

Booking Online

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  • (PPT 36)--

    2020-2-12 · 1.. 2.. 3.. 4.. . . . Tape parameter.

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  • Thread Grinding - The PST Group

    What is Thread Grinding? Thread grinding is a form of threading during which a CNC machine with an abrasive grinding wheel is used to cut the threads of the screw. Screws created through thread grinding are able to meet custom backlash requirements and tight tolerances. Read an overview of PST's Thread Grinding Process.

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  • ELECTRICAL DISCHARGE MACHINING

    2011-11-4 · Electrical Discharge Grinding ... graphite back t-e-on-odes-ed-in-pg. EDM IS A MACHINING METHOD TYPICALLY USED FOR HARD METALS WHICH ARE ELECTRICALLY CONDUCTIVE. IT MAKES POSSIBLE TO WORK WITH ... The EDM process is most widely used by the mould-making tool and die industries, but is

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  • 1

    2005-10-22 · The process by which the chyme is expelled from the stomach into the duodenum is called the gastric emptying. 2. Control 1) stomach: stimulating factor, neuronal and hormonal 2) duodenum: inhibiting factor entero-gastric reflex, hormones Enterogastric Reflex 4.

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  • (PDF) Development and Application of Grinding …

    In order to realize the system integration of aero engine blade self-adaption belt grinding unit, according to the production requirements determine the construction target and process of belt ...

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  • function of preheater in cement plant in ppt file - …

    cement plant process ppt – Grinding Mill China. Présentation PowerPoint … cooling Back preheating … acc cement production process ppt – Page2. Cement Plants, Cement Plant, … Cement PPT – Free download as PDF File … »More detailed

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  • Wafer deposition/metallization and back grind, …

    p172 - ppt. Data. September 2015. ... Studies the strength distribution of semiconductor chips on a wafer, and the influence of the back-side grinding process on the chip strength.. The three ...

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  • machining process.ppt | Machining | Grinding …

    2016-11-16 · Grinding Machine. 43 Grinding Machine. The primary purpose of a grinding wheel is to sharpen tools (eg. drill bits). The hard abrasive of the wheel is made for removing very hard materials like high speed steel. Never grind on the side of the wheel. Never grind a soft material such as Aluminum.

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  • machining process.ppt | Machining | Grinding …

    2016-11-16 · machining process.ppt - Free download as Powerpoint Presentation (.ppt), PDF File (.pdf), Text File (.txt) or view presentation slides online.

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  • Packaging Technologies Overview Dedicated to HEP ...

    2018-11-22 · Back Grinding Tape Laminating Back Grinding Back Grinding Tape Peeling Dicing Tape Mounting Full Cut Stress relief Dicing Edge chipping Thin wafer handling Thin wafer dicing Risks Note : The bumping process option is done before the wafer thinning Conventional process limitation below 100µm thickness :

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  • .ppt - MBA

    2017-11-21 · Wafer tape Back Grind Wafer Detape Wafer Saw Inline Grinding & Polish -- Accretech PG300RM Transfer Key Technology: 1. Low Thickness Variation: +/_ 1.5 Micron 2. Good Roughness: +/- 0.2 Micron 3. Thin Wafer Capacity: Up to 50 Micron 4.

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  • IC Assembly & Packaging PROCESS AND TECHNOLOGY

    2014-12-11 · Back Grinding y Process to thin down the wafer from original thickness to the required final thickness by abrasive grinding wheel in combination to mechanical/chemical polish y Common industries used wafer thickness 8-15 mils (200-300microns) y Current Machine capability 1.0 mil (25microns)

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  • PowerPoint Presentation

    2018-1-22 · Metal Cutting Manufacturing Processes Outline Metal Cutting Chip Formation Processes Control Conditions Back rake angle Shear angle Chip Formation Continuous formation Built up edge formation Discontinuous formation Effects Chip formation Shear angle Chip Formation Processes Shaping Turning Milling Drilling Sawing Broaching Grinding Machining Operations Machining …

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  • The oldest machining process - at the beginning of …

    2016-10-26 · GRINDING Abrasive machining: •The oldest machining process - "abrasive shaping"at the beginning of "Stone Era". •Free sand was applied between two moving parts to remove material and shape the stone parts. Grinding: •Removing of metal by a …

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  • Frequent problems during grinding – grindaix

    Grinding is a widespread production process and has long been a fixed part of almost every industrial production environment.During grinding, the parts (workpieces) are literally given the "final polish". Grinding operations thus contribute greatly to the quality of the finished workpiece.

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  • Thread Grinding - The PST Group

    What is Thread Grinding? Thread grinding is a form of threading during which a CNC machine with an abrasive grinding wheel is used to cut the threads of the screw. Screws created through thread grinding are able to meet custom backlash requirements and tight tolerances. Read an overview of PST's Thread Grinding Process.

    Get Price
  • GRINDING AND GRINDING OPERATIONS ppt | …

    2020-4-9 · CENTERLESS GRINDING • Centerless grinding is a machining process that uses abrasive cutting to remove material from a workpiece. centerless grinding differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of ...

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  • presentation on grinding process ppt presentation

    PPT Grinding machines PowerPoint presentation free to. It is a process of grinding curved surfaces. Surface may be straight or tapered. Work piece is mounted on two centers, one is tailstock centre and the other is headstock centre. The PowerPoint PPT presentation: "Grinding machines" is …

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  • GRINDING PROCESS

    Grinding Process Grinding is a surface finishing operation where very thin layer of material is removed in the form of dust particles. Thickness of material removed is in range of 0.25 to 0.50 mm. Tool used is a abrasive wheel Grinding machine is a power operated machine tool where, the work piece is fed

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  • (PPT 36)--

    2020-2-12 · 1.2.3.4. Tape parameterTape Setting SectionSample Tape evaluateBack

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  • Back Grinding Process 레포트 - kyoboBook

    Back Grinding 1. Back Grinding 란? Wafer 뒷면의 불필요한 막을 제거하고 필요이상으로 두꺼운 뒷면을 깎아 내어 저항을 줄이고 열전도율을 향상시키는 공정. 2. Back Grinding 의 필요성 - Sawing Operation 의 수월한 진행. - Package Thickness의 최소화. - 작업 중 ...

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  • Adwill:Semiconductor-related Products | LINTEC …

    2020-12-25 · Leading-edge Tape × Equipment solution created with semiconductor-related products 'Adwill.' We can provide a wide range of solutions from back grinding, dicing/mounting process to RFID traceability system.

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  • (PPT) ELECTRICAL DISCHARGE MACHINING | anil …

    ACCESSORIES APPLICATIONS Prototype production The EDM process is most widely used by the mould-making tool and die industries, but is becoming a common method of making prototype and production parts,especially in the aerospace, automobile and electronics industries in which production quantities are relatively low. Metal disintegration machiningSeveral manufacturers produce EDM …

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  • Thread Grinding - The PST Group

    What is Thread Grinding? Thread grinding is a form of threading during which a CNC machine with an abrasive grinding wheel is used to cut the threads of the screw. Screws created through thread grinding are able to meet custom backlash requirements and tight tolerances. Read an overview of PST's Thread Grinding Process.

    Get Price
  • BGA(PPT 55)__

    FOL– Back Grinding Taping Back Grinding De-Taping ?Wafer, (5mils~10mils); ?,(Active Area) 。

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  • Topic 3 Mechanical Pulping.ppt

    2013-1-2 · Grinding pressure 250kPa Grits deform fibre-lignin matrix Repeated visco-elastic deformation creates heat Increased heat in wood Heat softens lignin that's found in between fibres and helps to release the fibres Action of grinder Fibres are peeled back in …

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  • .ppt - MBA

    2017-11-21 · Wafer tape Back Grind Wafer Detape Wafer Saw Inline Grinding & Polish -- Accretech PG300RM Transfer Key Technology: 1. Low Thickness Variation: +/_ 1.5 Micron 2. Good Roughness: +/- 0.2 Micron 3. Thin Wafer Capacity: Up to 50 Micron 4.

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  • Topic 3 Mechanical Pulping.ppt

    2013-1-2 · Grinding pressure 250kPa Grits deform fibre-lignin matrix Repeated visco-elastic deformation creates heat Increased heat in wood Heat softens lignin that's found in between fibres and helps to release the fibres Action of grinder Fibres are peeled back in …

    Get Price
  • Introduction to Semico nductor Manufacturing and FA …

    2017-10-6 · Back End(BE) Process Wafer Back Grinding • The typical wafer supplied from 'wafer fab' is 600 to 750μm thick. • Wafer thinned down to the required thickness, 50um to 75um, by abrasive grinding wheel. › 1st step : Use a large grit to coarsely grind the wafer and

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  • Wafer deposition/metallization and back grind, …

    p172 - ppt. Data. September 2015. ... Studies the strength distribution of semiconductor chips on a wafer, and the influence of the back-side grinding process on the chip strength.. The three ...

    Get Price
  • Introduction to Semico nductor Manufacturing and FA …

    2017-10-6 · Back End(BE) Process Wafer Back Grinding • The typical wafer supplied from 'wafer fab' is 600 to 750μm thick. • Wafer thinned down to the required thickness, 50um to 75um, by abrasive grinding wheel. › 1st step : Use a large grit to coarsely grind the wafer …

    Get Price
  • The back-end process: Step 3 – Wafer backgrinding ...

    One thought on " The back-end process: Step 3 – Wafer backgrinding " enrique December 15, 2016 at 7:17 pm. We suggest you the UV release tape for attach wafer/glass to grind and polish. Once finish the grind and polish, use UV irradiation on the wafer/glass, the wafer/glass will easy picked up.

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  • Grinding and Polishing - ASM International

    2013-11-24 · Grinding uses fixed abrasives—the abrasive particles are bonded to the paper or platen—for fast stock removal. Polishing uses free abrasives on a cloth; that is, the abrasive particles are suspended in a lubricant and can roll or slide across the cloth and specimen. A book edited by Marinescu et

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